Benefits of Lasers for PCB depaneling/singulation

Many modern techniques use Routing, Die Cutting, and Dicing Saw methods for PCB depaneling

Benefits of Lasers for PCB depaneling/singulation

• No mechanical stress
• No tooling cost. No consumables.
• Versatility – ability to change applications by simply changing settings
• Fiducial Recognition – more precise and clean cut
• Optical Recognition before pcb depaneling/singulation process begins – CMS Laser is one of the few companies to provide this feature.
• Ability to depanel virtually any surface such as Teflon, Ceramics, Aluminum, Brass, Copper, etc
• High quality of cuts due to higher precision and laser control
• No design limitation – ability to cut virtually any complex and multidimensional boards

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